SEMI Standards are published three times a year. The new standards, part of the February 2006 publication cycle, join more than 720 standards that have been published by SEMI during the past 32 years.
The standards include a specification for round 200 mm polished monocrystalline gallium arsenide wafers, a test method for determination of particulate contamination from minienvironments, and a specification for job deck data format for variable shaped beam (VSB) mask writers.
"These new specifications, which include several applicable to the emerging growth area of compound semiconductors, will help reduce the industry's manufacturing costs and speed time-to-market," said Bettina Weiss, SEMI director of International Standards.
The new standards released today include: SEMI E54.18
Specification for Sensor/Actuator Network Specific Device Model for Vacuum Pump Device
SEMI E133.1
Provisional Specification for XML Messaging for Process Control System (PCS)
SEMI E142.2 Specification for SECS II Protocol for Substrate Mapping SEMI E143
Test Method for Measuring Power Variation into A 50-OHM Load and Power Variation and Spectrum into A Load with a VSWR of 2.0 at Any Phase Angle
SEMI E144
Provisional Specification for RF Air Interface between RFID Tags in Carriers and RFID Readers in Semiconductor Production and Material Handling Equipment
SEMI E145 Specification of Units for the Semiconductor Industry in XML SEMI E146
Test Method for the Determination of Particulate Contamination from Minienvironments
SEMI F102
Guide for Specification for Dimension of Components for Surface Mount Gas Distribution Systems
SEMI M9.8
Specification for Round 200 mm Polished Monocrystalline Gallium Arsenide Wafers
SEMI M63
Test Method for Measuring the AI Fraction in AIGaAs on GaAs Substrates by High Resolution X-ray Diffraction
SEMI M64
Test Method for the EL2 Deep Donor Concentration in Semi-Insulating GaAs Single Crystals by Infrared Absorption Spectroscopy
SEMI M65
Specification for Sapphire Substrate for Compound Semiconductor Epitaxial Wafers
SEMI MS1 Guide to Specifying Wafer-Wafer Bonding Alignment Targets SEMI P45 Specification for Job Deck Data Format for VSB Mask Writers
The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and micro-electromechanical systems (MEMS). About 1,100 volunteers worldwide participate in the program, which is made up of 17 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards.
SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.
